AED706 - *see School Specific Outline

Subject Title
*see School Specific Outline

Subject Description
This course will take the basic fundamentals taught in the first semester and further describe the techniques utilized to complete a PCB layout to meet industry standard.

Credit Status
One subject credit in the Electro Mechanical Design and the Applied Electronic Design Post Diploma program.

Learning Outcomes
Upon successful completion of this subject the student will be able to:

A. General Objectives:

Upon completion of the course the student will be able to:
(i) Work together as a team with one common goal to create a functionally correct Printed circuit Board.
(ii) Understand all facets of PCB design beginning with Schematic creation, Correct component creation, Placement strategies, Routing strategies, Silkscreen generation and generation of fabrication files and notes utilized in PCB fabrication.
(iii) Describe materials and production utilized in PCB fabrication.

B. Specific Objectives:

Schematic Creation
- Correct creation of schematic Cells
- Understanding schematic layout (flow of circuit)
- Cross page referencing
- Generation of netlist for PCB generation

Component Creation
- Different layers required for thru-hole and Surface mount components
- Understand different strategies for component creation
- Ability to understand Mechanical Component Specifications

Mechanical Drawings
- Ability to read and decifer mechanical drawings
- Creating Board outline
- Importance of tooling and mounting holes

Placement Strategies
- Importance of proximity of decoupling capacitors, oscillators etc.
- Single sided and Double sided placement requirements
- Rotation of components for assembly purposes
- Location of termination Circuitry

Routing Strategies
- Creation of power and Ground planes
- Routing of differential pairs, impedance controlled signals
- Different traces widths for power and ground signals
- Different trace widths for spacing violations

Silkscreen Generation
- Location for Reference designators
- Generation of board Identification

Dimensioning and Fabrication Notes
- Importance of board thickness for impedance calculations
- Copper weight requirements
- Board Stackup notes
- Importance of Solderpaste Stencil

Cheating and Plagiarism
Each student should be aware of the College's policy regarding Cheating and Plagiarism. Seneca's Academic Policy will be strictly enforced.

To support academic honesty at Seneca College, all work submitted by students may be reviewed for authenticity and originality, utilizing software tools and third party services. Please visit the Academic Honesty site on http://library.senecacollege.ca for further information regarding cheating and plagiarism policies and procedures.

Discrimination/Harassment
All students and employees have the right to study and work in an environment that is free from discrimination and/or harassment. Language or activities that defeat this objective violate the College Policy on Discrimination/Harassment and shall not be tolerated. Information and assistance are available from the Student Conduct Office at student.conduct@senecacollege.ca.

Accommodation for Students with Disabilities
The College will provide reasonable accommodation to students with disabilities in order to promote academic success. If you require accommodation, contact the Counselling and Disabilities Services Office at ext. 22900 to initiate the process for documenting, assessing and implementing your individual accommodation needs.